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FPC 0.5-31 Series — Built for Thin and Light Devices
Industry & Technology|
2026-10-29 13:49:42
As one of the early players in the automotive electronics industry, BJD is committed to providing reliable solutions. Our connectors serve automotive electronics, industrial control, LED commercial displays, medical, security, and many other fields. BJD is a provincial "Specialized, Refined, Distinctive and Innovative" enterprise and a National High-Tech Enterprise with a CNAS-accredited laboratory supporting product quality verification.
01 Development Background
As laptops, tablets, smartphones, wearables, and other electronics become thinner and more compact, internal space keeps shrinking while the volume and speed of signals transmitted between display modules and the main board keep rising. Connectors must achieve three things within a height of around 1mm: stable transmission of high-speed signals such as eDP and MIPI, reliable contact, and efficient production-line assembly. This is exactly why BJD developed the FPC0.5-31 Series.
02 Product Overview
The FPC0.5-31 Series is a front-flip FPC/FFC connector with a 0.5mm pitch and an on-board height of only 1.0mm. It supports high-speed display interfaces such as eDP 1.3 and MIPI D-PHY, works with 0.3mm-thick FPC/FFC cables, and provides a reliable solution for signal interconnection in compact spaces.
| Challenge | Why It Matters | Our Design |
|---|---|---|
| Limited space | The thinner the device, the less height left for the connector | Only 1.0mm tall — thinner than a coin |
| Fine pitch | Cable width is limited, so contacts must fit in a very narrow space | 0.5mm pitch; 4~30 pin options planned |
| High speed | Display data is large and fast, so contact must be stable | Compatible with eDP1.3 / MIPI D-PHY |
| Easy assembly | The cable is thin and soft; it must insert smoothly and lock firmly on the line | Front-flip lock: insert the cable, then flip the cover down; supports 0.3mm-thick FPC/FFC |
| Durability | Heat builds up inside devices; materials must withstand it and be compliant | -40 to +105°C; LCP housing, halogen-free, RoHS certified |
03 Product Features
- Compact, low-profile, and fast
0.5mm pitch and 1.0mm low height with support for 0.3mm-thick FPC/FFC easily fit tight stacking spaces; eDP 1.3 / MIPI D-PHY compatibility supports high-speed signal transmission between display modules and the main board. - Front-flip structure for easier assembly
The front-flip structure makes FPC/FFC insertion easy and simplifies assembly and debugging; SMT surface mounting ensures high production efficiency. - Reliable contact, durable and eco-friendly
Gold-plated copper-alloy signal contacts ensure reliable connection; operating temperature range -40°C to +105°C; halogen-free materials, RoHS certified.
Product Attributes
| Item | Specification | Unit |
|---|---|---|
| Pitch | 0.5 | mm |
| Height | 1.0 | mm |
| Pin Count | 4, 6, 8, 10, 20, 30 | ckt |
| Operating Temp. | -40 to +105 | °C |
| Rated Current | 0.5 | A |
| Rated Voltage | 50 | V |
| Contact Resistance | 120 | mΩ |
| Withstanding Voltage | 250 | V |
| Durability (Mating Cycles) | 20 | times |
Note: The 10-pin version is currently developed. Other pin counts (4/6/8/20/30) are planned — please contact BJD in advance if required.
Materials
| Component | Material | Plating |
|---|---|---|
| Housing (Insulator) | LCP | / |
| Flip Cover (Actuator) | PA10T | / |
| Signal Contact | Copper Alloy | Gold-Plated |
| Latch Contact | Copper Alloy | Gold-Plated |
| Shim / Reinforcement Plate | Brass | Tin-Plated |
SMT mounting: taking the 10-pin version as an example, there are 12 solder feet in total — 10 signal pins, plus left and right latch contacts for locking and fixing. The product can be named XXPIN or XXPIN+2PIN.
04 Dimension Table
Outline drawing of the FPC0.5-31 Series and dimensions for each pin count. Unit: mm; tolerances as noted on the drawing.
| POS. | A | B | C | D | E | F | G | H |
|---|---|---|---|---|---|---|---|---|
| 4 | 5 | 2.5 | 3.53 | 4.38 | 4.1 | 4.9 | 3.5 | 1.5 |
| 6 | 6 | 3.5 | 4.53 | 5.38 | 5.1 | 5.9 | 4.5 | 2.5 |
| 8 | 7 | 4.5 | 5.53 | 6.38 | 6.1 | 6.9 | 5.5 | 3.5 |
| 10 | 8 | 5.5 | 6.53 | 7.38 | 7.1 | 7.9 | 6.5 | 4.5 |
| 20 | 13 | 10.5 | 11.53 | 12.38 | 12.1 | 12.9 | 11.5 | 9.5 |
| 30 | 18 | 15.5 | 16.53 | 17.38 | 17.1 | 17.1 | 16.5 | 14.5 |
05 Applications
The FPC0.5-31 Series is designed for the dual challenge of "compact space + high-speed signals". Typical applications include:
- Laptops / tablets: high-speed connection between the display and the main board; the 1.0mm low profile fits the compact space beneath display modules;
- Smartphones / wearables: high-speed signal transmission for display and sensor modules; 0.5mm pitch suits high-density layouts;
- Portable gaming consoles: high-speed display signal transmission in a compact body;
- AI voice devices / portable medical devices: reliable signal interconnection in small devices, with a wide -40°C to +105°C range for diverse environments.
06 Recommended FPC/FFC Cable
The following are reference material structures for FPC/FFC cables; please confirm specific specifications with your cable supplier. The thickness tolerance of FFC is approximately ±20μm.
1. Single-sided FPC (Flexible Printed Circuit)
| Material Name | Material | Thickness (μm) |
|---|---|---|
| Polyester Film | (12) | |
| Adhesive | Thermoplastic Polyester | (30) |
| Gold Plated Annealed Copper Foil | 35 | |
| Adhesive | Polyester | 30 |
| Polyester | 12 | |
| Adhesive | Polyester | 30 |
| Reinforcing Film | Polyester | 188 |
| Total | 295 |
2. Double-sided FPC (Flexible Printed Circuit)
| Material Name | Material | Thickness (μm) |
|---|---|---|
| Cover Lay Film | Polyimide 1mil | (25) |
| Cover Adhesive | (25) | |
| Surface Treatment | 0.2μm Thick Gold Plated over 1-5μm Thick Nickel Underplating | 3 |
| Through-hole Copper | Cu | 15 |
| Copper Foil | Cu 1/2oz | 18 |
| Base Adhesive | Thermosetting Adhesive | 18 |
| Base Film | Polyimide 1mil | 25 |
| Base Adhesive | 18 | |
| Copper Foil | Cu 1/2oz | (18) |
| Cover Adhesive | Thermosetting Adhesive | 25 |
| Cover Lay Film | Polyimide 1mil | 25 |
| Reinforcement Adhesive | Thermosetting Adhesive | 50 |
| Reinforcing Film | Polyimide 4mil | 100 |
| Total | 297 |
3. FFC (Flexible Flat Cable)
| Material Name | Material | Thickness (μm) |
|---|---|---|
| Cover Lay Film | Polyimide 1mil | (25) |
| Cover Adhesive | (25) | |
| Surface Treatment | 0.2μm Thick Gold Plated over 1-5μm Thick Nickel Underplating | 3 |
| Copper Foil | Cu 1oz | 35 |
| Base Adhesive | Thermosetting Adhesive | 25 |
| Base Film | Polyimide 1mil | 25 |
| Reinforcement Adhesive | Thermosetting Adhesive | 35 |
| Reinforcement Film | Polyimide 7mil | 175 |
| Total | 298 |
This document is for reference only; final specifications are subject to confirmed drawings. For further product details or samples, please contact BJD's sales/technical team.
07 Summary
Low profile, high-speed signal compatibility, and easy assembly — the FPC0.5-31 Series offers customers a compact, reliable connection solution for thin and light electronic devices.
[Contact Us]
Tel: +86-769-82093170
Email: support@beijida.com
Website: https://beijida.com/
Focused, therefore professional — we look forward to working with you!
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